the requirement of high power large size integrated circuit (IC) package for data center plays a crucial role. Flip chip ball grid array (FCBGA) is the mainstream of this kind of application, no matter integrates the functions by system on a chip (SoC), multi chips module (MCM), fan-ou...
Refer to the product data sheet for package details.Code HFC Name HFCBGA (HFC196) POD Number PD-2254 JEDEC Pub 95 N/A Pin Pitch (mm) 1 Length (mm) 15 Width (mm) 15 Height (mm) 2.94 Package File HFC196.pdf Products using this package PI7C9X3G808GP PI7C9X3G808GPQ ...
Single package size: 29X22X8 cm Single gross weight: 1.000 kg Show more Customization Know your supplier Shenzhen Gold Network Information Technology Co., Ltd. 1 yrLocated in CN View more productsView profile Product descriptions from the supplier ...
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数据列表 UltraScale FPGA Package, Pinouts Prod Spec; 标准包装 Virtex UltraScale+ FPGA Datasheet; 零件状态 1 产品族 集成电路(IC) 系列 嵌入式 - FPGA(现场可编程门阵列) 其它名称 Virtex® UltraScale+™ LAB/CLB 数 162960 逻辑元件/单元数 2851800 总RAM 位数 74344038 I/O 数 624 电压- 供电 ...
Today, investing in a new test capacity has become one of the most strategic decisions for a High End PCB manufacturer, and even more challenging for the Semiconductor Packaging substrates segment, with the spread of Flip Chip (FC-BGA) and System in Package (SiP) applications.Christophe Vaucher...
属性描述 Case/Package - Halogen Free Status - Input Bias Current - Lead-Free Status - Lifecycle Status - Mounting Style - Number of Channels - Number of Circuits - Operating Temperature - Packaging - Number of Pins - REACH SVHC Compliance - RoHS - Supply Current - Supply Voltage (DC) -相...
Single package size: 4X4X4 cm Single gross weight: 1.000 kg Show more Lead time Know your supplier Shenzhen HZJM Technology Co., Ltd. 1 yrLocated in CN View more productsView profile Product descriptions from the supplier Overview 10 - 19 pieces ...
Series 196-BBGA Manufacturing Date Code Newest Packaging and delivery Selling Units: Single item Single package size: 10X10X10 cm Single gross weight: 10.000 kg Show more Lead time Samples Maximum order quantity: 1 piece Sample price: $0.02/pieceOrder sampleKnow your supplier ...
(DLA, direct lid attach). For high power application, e.g., hundred watts power dissipation, a heat sink on the top of the package for heat dissipation is the universal method for thermal design. At this situation, chip exposed design packages, include FCBGA and stiffener ring only HFC...